The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Jan. 24, 2022
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Radesh Jewram, Lakeville, MN (US);
Yuan Zhao, Tustin, CA (US);
Assignee:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02H 5/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01);
Abstract
An electronic package includes a thermal interface for dissipating heat from an electronic component array including a plurality of electronic components secured to a substrate. The thermal interface includes a thin heat spreading layer for transferring heat input from the electronic components along directions transverse to heat flux. The heat spreading layer is part of a laminate structure that is efficiently utilized by spreading thermal energy across an input plane.