The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Mar. 24, 2022
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Yu-Lin Hsu, Tainan, TW;
Kuan-Chu Wu, Kaohsiung, TW;
Ting-Yu Ke, Changhua County, TW;
Min-Hsiung Liang, Hsinchu County, TW;
Yu-Ming Peng, Taichung, TW;
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/538 (2006.01); H05K 3/00 (2006.01); H01L 23/31 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/119 (2013.01); H01L 21/4846 (2013.01); H01L 23/13 (2013.01); H01L 23/5386 (2013.01); H05K 3/0014 (2013.01); H01L 23/3121 (2013.01); H05K 1/181 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/09118 (2013.01);
Abstract
An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.