The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Nov. 09, 2022
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Shusaku Shibata, Osaka, JP;

Teppei Niino, Osaka, JP;

Yosuke Nakanishi, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/09 (2006.01); H05K 3/24 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H05K 1/05 (2013.01); H05K 1/09 (2013.01); H05K 3/24 (2013.01); H05K 3/28 (2013.01);
Abstract

Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the conductive pattern, and a third protective layer disposed between the conductive pattern and the second insulating layer and protecting the conductive pattern. The third protective layer consists of a metal oxide.


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