The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Oct. 25, 2022
Applicant:

Honeywell International Inc., Charlotte, NC (US);

Inventors:

Karthikeyan Paramanandam, Bangalore, IN;

Pedro Luis Lebron, San Antonio, PR;

Assignee:

Honeywell International Inc., Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0212 (2013.01); H05K 1/0298 (2013.01);
Abstract

An electronic assembly comprises a printed circuit board including a plurality of stacked layers, wherein the stacked layers comprise a plurality of conductive layers, a plurality of dielectric layers respectively interposed between the conductive layers, and one or more phase change material layers interposed between at least one pair of the dielectric layers or at least one pair of the conductive layers. During a phase change, the one or more phase change material layers are configured to absorb thermal energy at a phase transition temperature to provide enhanced cooling of the printed circuit board. In some embodiments, the printed circuit board can be a metal core printed circuit board.


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