The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Feb. 08, 2022
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Takehiko Kikuchi, Osaka, JP;

Naoki Fujiwara, Osaka, JP;

Nobuhiko Nishiyama, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/10 (2021.01); H01S 5/02 (2006.01); H01S 5/22 (2006.01); H01S 5/30 (2006.01);
U.S. Cl.
CPC ...
H01S 5/1003 (2013.01); H01S 5/021 (2013.01); H01S 5/22 (2013.01); H01S 5/3013 (2013.01);
Abstract

A method of manufacturing a semiconductor optical device includes a step of bonding a semiconductor element to a substrate that includes silicon, the semiconductor element being made of a III-V compound semiconductor and having optical gain; after the step of bonding the semiconductor element, a step of molding the semiconductor element by wet-etching; and after the step of molding the semiconductor element, a step of forming a mesa at the semiconductor element. The substrate includes a waveguide, a groove that extends along the waveguide, a terrace that is positioned on a side of the groove opposite to the waveguide, and a wall that covers the groove. The step of bonding the semiconductor element is a step of bonding the semiconductor element to the waveguide, the groove, the terrace, and the wall of the substrate.


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