The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Jul. 14, 2021
Applicant:

Quanzhou Sanan Semiconductor Technology Co., Ltd., Quanzhou, CN;

Inventors:

Jianbin Tu, Xiamen, CN;

Junpeng Shi, Xiamen, CN;

Weng-Tack Wong, Xiamen, CN;

Yanqiu Liao, Xiamen, CN;

Chen-ke Hsu, Xiamen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/52 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light emitting diode (LED) package includes a substrate, a metal stage, at least one LED chip and a packaging material. The substrate has an super surface, and a lower surface opposite to the upper surface. The metal stage is formed on the upper surface of the substrate, and has a lumpy structure. The LED chip is mounted on the metal stage. The packaging material covers the LED chip, the metal stage and the substrate. The packaging material and the lumpy structure of the metal stage are engaged with each other.


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