The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Jan. 28, 2022
Applicant:

Creeled, Inc., Durham, NC (US);

Inventors:

Joseph M. Favale, Jr., Cary, NC (US);

Robert David Schmidt, Wake Forest, NC (US);

Assignee:

CreeLED, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 25/075 (2006.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01);
Abstract

Light-emitting diode (LED) packages, and more particularly arrangements of light-altering coatings in LED packages are disclosed. Exemplary LED packages may include lead frame structures that are at least partially encased by a housing. Arrangements of light-altering coatings may be provided that cover one or more portions of lead frame structures exposed within LED package recesses. By providing light-altering coatings that cover lead frame structures within package recesses, negative impacts from potential lead frame discoloration due to environmental exposure may be reduced. Additionally, such light-altering coatings may be configured to reflect light emissions from LED chips before reaching portions of lead frame structures. Light-altering coating arrangements are disclosed where light-altering coatings are arranged in contact with LED chips or, alternatively, in a spaced relationship with LED chips. Retention structures are disclosed that may define boundaries of light-altering coatings along recess floors of corresponding LED packages.


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