The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

May. 21, 2024
Applicant:

Quanzhou San'an Semiconductor Technology Co., Ltd., Quanzhou, CN;

Inventors:

Junpeng Shi, Fujian, CN;

Chen-Ke Hsu, Fujian, CN;

Chang-Chin Yu, Fujian, CN;

Yanqiu Liao, Fujian, CN;

Zhenduan Lin, Fujian, CN;

Zhaowu Huang, Fujian, CN;

Senpeng Huang, Fujian, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 27/15 (2006.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 27/156 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01);
Abstract

A LED device includes multiple LED chips each including opposite first and second surfaces, a side surface, and an electrode assembly disposed on the second surface and including first and second electrodes. The first surface of each of the LED chips is a light exit surface. The LED device further includes an electric circuit layer assembly disposed on the second surfaces of the LED chips and having opposite first and second surfaces and a side surface. The first surface is electrically connected to the first and second electrodes. The LED device further includes an encapsulating layer enclosing the LED chips and the electric circuit layer assembly to expose the second surface of the electric circuit layer assembly.


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