The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Mar. 10, 2022
Applicant:

Quanzhou Sanan Semiconductor Technology Co., Ltd., Nanan, CN;

Inventors:

Shuning Xin, Xiamen, CN;

Chen-Ke Hsu, Xiamen, CN;

Aihua Cao, Xiamen, CN;

Junpeng Shi, Xiamen, FJ;

Weng-Tack Wong, Xiamen, CN;

Yanqiu Liao, Xiamen, CN;

Zhen-Duan Lin, Xiamen, CN;

Changchin Yu, Xiamen, CN;

Chi-Wei Liao, Xiamen, CN;

Zheng Wu, Xiamen, CN;

Chia-En Lee, Xiamen, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/38 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/382 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01);
Abstract

A light-emitting diode (LED) packaging module includes a plurality of LED chips spaced apart from one another, an encapsulating layer that fills in a space among the LED chips, a light-transmitting layer disposed on the encapsulating layer, a wiring assembly disposed on and electrically connected to the LED chips, and an insulation component that covers the encapsulating layer and the wiring assembly. Each of the LED chips includes an electrode assembly including first and second electrodes. The light-transmitting layer includes a light-transmitting layer that has a light transmittance greater than that of the encapsulating layer.


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