The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Feb. 07, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package including a package substrate including first and second bonding pads, third bonding pads spaced apart from the first bonding pads, and fourth bonding pads spaced apart from the second bonding pads; a first chip stack including first chips stacked on the package substrate, each first chip including first signal pads and first power/ground pads alternately arranged; a second chip stack including second chips stacked on the first chip stack, each second chip including second signal pads and second power/ground pads alternately arranged; first lower wires that connect the first signal pads to the first bonding pads; second lower wires that connect the first power/ground pads to the second bonding pads; first upper wires that connect the second signal pads of the second chips to the third bonding pads; and second upper wires that connect the second power/ground pads of the second chips to the fourth bonding pads.