The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Nov. 01, 2021
Applicant:
Protec Co., Ltd., Gyeonggi-do, KR;
Inventors:
Youn Sung Ko, Chungcheongnam-do, KR;
Geunsik Ahn, Seoul, KR;
Assignee:
PROTEC CO., LTD., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 1/005 (2006.01); B23K 26/03 (2006.01); B23K 26/06 (2014.01); B23K 26/18 (2006.01); B23K 26/324 (2014.01); B23K 37/04 (2006.01); H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01S 3/101 (2006.01); B23K 26/08 (2014.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 1/0056 (2013.01); B23K 26/032 (2013.01); B23K 26/034 (2013.01); B23K 26/0626 (2013.01); B23K 26/18 (2013.01); B23K 26/324 (2013.01); B23K 37/0435 (2013.01); H01L 21/56 (2013.01); H01L 21/67 (2013.01); H01L 21/67276 (2013.01); H01S 3/101 (2013.01); B23K 26/0869 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08); H01L 2224/75263 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/75901 (2013.01);
Abstract
A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.