The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Sep. 09, 2021
Applicant:
Tanaka Denshi Kogyo K. K., Saga, JP;
Inventors:
Hiroyuki Amano, Saga, JP;
Yuki Antoku, Saga, JP;
Takeshi Kuwahara, Saga, JP;
Tsukasa Ichikawa, Saga, JP;
Osamu Matsuzawa, Saga, JP;
Wei Chen, Saga, JP;
Assignee:
TANAKA DENSHI KOGYO K. K., Kanzaki-gun, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); H01L 23/49582 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/4845 (2013.01); H01L 2224/85035 (2013.01); H01L 2924/01016 (2013.01); H01L 2924/01034 (2013.01); H01L 2924/01052 (2013.01);
Abstract
A Pd-coated Cu bonding wire of an embodiment contains Pd of 1.0 to 4.0 mass %, and a S group element of 50 mass ppm or less in total (S of 5.0 to 12.0 mass ppm, Se of 5.0 to 20.0 mass ppm, or Te of 15.0 to 50 mass ppm). At a crystal plane of a cross section of the wire, a <100> orientation ratio is 15% or more, and a <111> orientation ratio is 50% or less. When a free air ball is formed on the wire and a tip portion is analyzed, a Pd-concentrated region is observed on the surface thereof.