The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

May. 19, 2020
Applicant:

Pragmatic Semiconductor Limited, Cambridge, GB;

Inventors:

Brian Cobb, Sedgefield Durham, GB;

Richard Price, Sedgefield Durham, GB;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/522 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 24/19 (2013.01); H01L 23/367 (2013.01); H01L 23/4985 (2013.01); H01L 23/5225 (2013.01); H01L 23/562 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/20 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 1/181 (2013.01); H01L 24/81 (2013.01); H01L 24/82 (2013.01); H01L 2224/03318 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/16268 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32268 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81898 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01);
Abstract

There is provided a flexible electronic structure for bonding with an external circuit. The flexible electronic structure comprising: a flexible body having a first surface, the flexible body comprising at least one electronic component; at least one contact element configured to bond with the external circuit, the at least one contact element operatively coupled with the at least one electronic component and provided at the first surface of the flexible body, and arranged to operably interface with the external circuit after bonding, and at least one support element provided at the first surface of the flexible body, each support element arranged to contact a corresponding surface element disposed on a first surface of an external structure comprising the external circuit.


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