The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Sep. 08, 2021
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

Mark E. Henschel, Phoenix, AZ (US);

Songhua Shi, Tempe, AZ (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); A61N 1/375 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 24/06 (2013.01); A61N 1/3754 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/06182 (2013.01); H01L 2224/13026 (2013.01);
Abstract

Various embodiments of an electronic package and an implantable medical device that includes such package are disclosed. The electronic package includes a monolithic package substrate having a first major surface and a second major surface, an integrated circuit disposed in an active region of the package substrate, and a conductive via disposed through an inactive region of the package substrate and extending between the first major surface and the second major surface of the package substrate. The conductive via is separated from the active region by a portion of the inactive region of the substrate.


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