The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Apr. 15, 2022
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A module includes a substrate having a first surface, a first component and a second component that are mounted on the first surface, a first conductive material mounted between the first component and the second component, a first sealing resin provided on the first surface to cover the first component, the second component, and the first conductive material, and a first shield film that covers the first sealing resin, in which the first sealing resin has a recess to expose at least a part of the first conductive material, the first shield film extends along an inner surface of the recess and is, thereby, electrically connected to the first conductive material, the first shield film is provided with an opening in the recess, a metal bump is disposed inside the recess, and the metal bump is electrically connected to the first conductive material through the opening.