The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Sep. 29, 2021
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Tadashi Nomura, Nagaokakyo, JP;

Toru Komatsu, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/268 (2006.01); H01L 21/56 (2006.01); H01L 23/552 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/268 (2013.01); H01L 21/565 (2013.01); H01L 23/552 (2013.01); H01L 25/00 (2013.01);
Abstract

A module is provided that includes a substrate having a first main surface, a component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the component, and a shield film covering at least an upper surface of the first sealing resin. The shield film includes a protective layer exposed to the outside and a conductive layer covered by the protective layer. The color of a surface of the conductive layer closer to the protective layer is different from the color of the protective layer. Moreover, the laser absorption coefficient of a material of the protective layer is higher than the laser absorption coefficient of a material forming the surface of the conductive layer closer to the protective layer. The module includes a marking section that is not covered by the protective layer and from which the conductive layer is exposed.


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