The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Feb. 22, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes an interposer having a pad insulating film, a first lower pad exposed from a lower surface of the pad insulating film, the first lower pad including a first extension and a second extension spaced apart from each other and extending side by side in a first direction, and a first connection extending in a second direction intersecting the first direction and connecting the first extension and the second extension, and a redistribution structure that covers an upper surface of the pad insulating film, first interposer bumps on a lower surface of the interposer and spaced apart from each other, at least a part of each of the first and second extensions being connected to one of the first interposer bumps, and a first semiconductor chip on an upper surface of the interposer and electrically connected to the redistribution structure.