The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Apr. 07, 2022
Applicant:
SK Hynix Inc., Icheon-si, KR;
Inventors:
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 2224/48229 (2013.01);
Abstract
A semiconductor package includes a package substrate, a connection pad including a recessed portion disposed on one surface of the package substrate, and an insulating pattern disposed on the one surface of the package substrate to be spaced apart from the connection pad. The connection pad includes an outer sidewall, an inner sidewall in the recessed portion inclining in an inward direction from an upper portion, and a groove pattern formed on the inner sidewall.
Kim, Si. (2025). Semiconductor package including connection pad including groove pattern (U.S. Patent No. 12237251). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12237251
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile