The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Mar. 24, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Kyoungsik Cho, Suwon-si, KR;
Hogon Kim, Hwaseong-si, KR;
Myoungryul Han, Hwaseong-si, KR;
Hyunchul Kwun, Chungcheongnam-do, KR;
Dongha Kim, Hwaseong-si, KR;
Jangho Son, Yongin-si, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); C23C 16/52 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); C23C 16/4583 (2013.01); C23C 16/46 (2013.01); C23C 16/52 (2013.01); H01J 37/32724 (2013.01); H01L 21/67069 (2013.01);
Abstract
A semiconductor processing system includes; a chamber, a substrate support disposed in the chamber, and a temperature controller including a thermal section disposed under the substrate support and a coupling section including at least one coupling section member. The thermal section includes a first plate and a second plate spaced apart under the substrate support, and each of the first plate and the second plate is coupled to a side portion of the substrate by at least one coupling section member.