The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Jul. 09, 2020
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Lee Francis, Milton Keynes, GB;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/02 (2006.01); H01F 27/06 (2006.01); H01F 27/24 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01); H02M 5/458 (2006.01); H02P 27/04 (2016.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/022 (2013.01); H01F 27/06 (2013.01); H01F 27/24 (2013.01); H01F 41/0206 (2013.01); H01F 41/041 (2013.01); H01F 41/127 (2013.01); H02M 5/458 (2013.01); H02P 27/04 (2013.01);
Abstract
A magnetic-component module includes a substrate, a header on the substrate, a core, a winding including a trace on the header, and an overmold material encapsulating the header, the core, and the trace.