The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Mar. 16, 2022
Applicants:

Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Dexi Kong, Beijing, CN;

Cheng Li, Beijing, CN;

Lin Zhou, Beijing, CN;

Zixiao Chen, Beijing, CN;

Gen Huang, Beijing, CN;

Shoujin Cai, Beijing, CN;

Jie Zhang, Beijing, CN;

Jin Cheng, Beijing, CN;

Yingzi Wang, Beijing, CN;

Caixia Zhang, Beijing, CN;

Qian Tan, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G06V 40/13 (2022.01);
U.S. Cl.
CPC ...
G06V 40/1318 (2022.01);
Abstract

Provided is a fingerprint sensor, including: a substrate; a plurality of photosensitive devices disposed on the substrate; a light-emitting module disposed on a side, distal to the substrate, of the plurality of photosensitive devices; and a protective cover disposed on a side, distal to the substrate, of the light-emitting module, wherein the protective cover is provided with a plurality of conductive structures electrically connected to the light-emitting module, the plurality of conductive structures being in one-to-one correspondence with the plurality of photosensitive devices, and an orthographic projection of each conductive structure onto the substrate at least partially being overlapped with an orthographic projection of the photosensitive device corresponding to the conductive structure onto the substrate.


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