The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Sep. 16, 2022
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Adam R. Girard, Blue Ridge, TX (US);

Gabriel A. Payan, McKinney, TX (US);

Charlie Y. Chen, Frisco, TX (US);

Christopher J. Cormier, Anna, TX (US);

Mark D. Sprinkel, Plano, TX (US);

Assignee:

Raytheon Company, Arlington, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/33 (2023.01); F17C 13/06 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); F17C 13/06 (2013.01); H04N 5/33 (2013.01); F17C 2201/0119 (2013.01); F17C 2205/0311 (2013.01); F17C 2223/0161 (2013.01); F17C 2227/0383 (2013.01); F17C 2227/0397 (2013.01); F17C 2260/031 (2013.01); F17C 2270/0509 (2013.01); G06T 2207/10048 (2013.01);
Abstract

An apparatus includes a Dewar having an endcap. The apparatus also includes a heat sink and a thermal interface material configured to thermally couple the endcap of the Dewar to the heat sink. The thermal interface material includes an amorphous pliable material that is configured to transfer thermal energy between the endcap of the Dewar and the heat sink without structurally coupling the Dewar to the heat sink. A thermal shoe may be positioned between the thermal interface material and the heat sink, and the thermal shoe may be configured to hold the thermal interface material against the endcap. The thermal shoe may have (i) a smaller cross-sectional size in a portion of the thermal shoe contacting the thermal interface material and (ii) a larger cross-sectional size in a portion of the thermal shoe contacting the heat sink.


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