The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

May. 11, 2022
Applicant:

Semes Co., Ltd., Chungcheongnam-do, KR;

Inventors:

Myung Hwan Eom, Gyeonggi-do, KR;

Sang Hyun Son, Busan, KR;

Jae Hong Kim, Chungcheongnam-do, KR;

Assignee:

SEMES CO., LTD., Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05D 7/06 (2006.01); G01F 1/667 (2022.01); G05B 19/416 (2006.01);
U.S. Cl.
CPC ...
G05D 7/0623 (2013.01); G01F 1/667 (2013.01); G05B 19/416 (2013.01); G05D 7/0635 (2013.01); G05B 2219/37371 (2013.01);
Abstract

A flow rate control apparatus with improved reliability is provided. The flow rate control apparatus comprises a flow rate measuring unit for measuring a flow rate of chemical solution in a chemical solution supply line, a flow rate control unit for comparing a preset target flow rate profile and an applied flow rate profile, and controlling the flow rate of the chemical solution so that the applied flow rate profile matches the target flow rate profile, and a processor for switching the flow rate control unit to a first mode in response to a signal for the flow rate of the chemical solution measured by the flow rate measuring unit being less than a preset level, wherein, in the first mode, the applied flow rate profile includes a profile of a flow rate estimation model simulated using a flow rate of chemical solution measured by the flow rate measuring unit.


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