The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Mar. 27, 2024
Applicant:

Hisense Broadband Multimedia Technologies Co., Ltd., Shandong, CN;

Inventors:

Honghao Zhang, Shandong, CN;

Benzheng Dong, Shandong, CN;

Yifan Xie, Shandong, CN;

Kai Liu, Shandong, CN;

Qinhao Fu, Shandong, CN;

Dan Li, Shandong, CN;

Tengfei Wang, Shandong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); G02B 6/42 (2006.01); H04B 10/40 (2013.01);
U.S. Cl.
CPC ...
G02B 6/4246 (2013.01); G02B 6/4269 (2013.01); G02B 6/4292 (2013.01); H04B 10/40 (2013.01);
Abstract

The present disclosure discloses an optical module including a circuit board; a housing assembly including a light-receiving portion and a light-emitting cavity separated via a separation board and stacked one above the other, one side of the housing assembly adjacent to the circuit board being provided with a first notch through which one end of the circuit board is inserted into the housing assembly; a light-receiving assembly disposed in the light-receiving portion and electrically connected to an upper surface of the circuit board; and a light-emitting assembly disposed in the light-emitting cavity and electrically connected to a lower surface of the circuit board; a concave region is formed in the light-emitting cavity, and a laser assembly of the light-emitting assembly is arranged therein to lift the laser assembly to reduce height difference between wire bonding surface of the laser assembly and lower surface of the circuit board.


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