The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Jan. 30, 2020
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventor:
Yusuke Takatsuka, Kanagawa, JP;
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 7/481 (2006.01); G01S 17/894 (2020.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
G01S 7/4816 (2013.01); H01L 27/1462 (2013.01); H01L 27/14627 (2013.01); H01L 27/14629 (2013.01); H01L 27/14636 (2013.01); H01L 27/14645 (2013.01); H01L 27/14649 (2013.01); G01S 17/894 (2020.01);
Abstract
A sensor including: a semiconductor substrate () having a first surface (S) and a second surface (S) opposed to each other, and including an avalanche photodiode; an on-chip lens () provided on side of the first surface (S) of the semiconductor substrate (); a first reflective member () provided on the on-chip lens (); and a wiring layer () provided on side of the second surface (S) of the semiconductor substrate (), and including a second reflective member ().