The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Jun. 05, 2018
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Shengqian Kong, Hillsborough, NJ (US);

Yayun Liu, Franklin Park, NJ (US);

Wenhua Zhang, Farmington, CT (US);

Stephen Hynes, Dublin, IE;

John G. Woods, Farmington, CT (US);

Jiangbo Ouyang, Wallingford, CT (US);

Chunyu Sun, Shanghai, CN;

Bahram Issari, Glastonbury, CT (US);

Assignee:

Henkel AG & Co. KGaA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 183/06 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); B32B 43/00 (2006.01); C09J 5/00 (2006.01); C09J 5/06 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C09J 7/35 (2018.01); C09J 131/00 (2006.01);
U.S. Cl.
CPC ...
C09J 183/06 (2013.01); B32B 7/12 (2013.01); B32B 37/12 (2013.01); B32B 37/18 (2013.01); B32B 43/006 (2013.01); C09J 5/00 (2013.01); C09J 5/06 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/00 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C09J 7/35 (2018.01); C09J 131/00 (2013.01); C09J 2301/40 (2020.08); C09J 2301/414 (2020.08); C09J 2301/416 (2020.08); C09J 2301/502 (2020.08); C09J 2483/00 (2013.01);
Abstract

Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.


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