The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Jul. 31, 2020
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Eric Thomas Martin, Corvallis, OR (US);
Garrett E. Clark, Corvallis, OR (US);
Jeremy Spencer, Corvallis, OR (US);
Vincent C. Korthuis, Corvallis, OR (US);
Rogelio Cicili, San Diego, CA (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04541 (2013.01); B41J 2/0458 (2013.01);
Abstract
A fluidic die includes fluid-transfer elements, and a temperature sensor to monitor a temperature on the fluidic die. The fluidic die includes a trickle-warming circuit to warm fluid transferrable by the fluid-transfer elements, and a pulse-warming circuit to warm the fluid. A warming control circuit selectively activates the trickle-warming and pulse-warming circuits.