The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Mar. 16, 2021
Applicants:

Interface Technology (Chengdu) Co., Ltd., Chengdu, CN;

Interface Optoelectronics (Shenzhen) Co., Ltd., Shenzhen, CN;

General Interface Solution Limited, Miaoli County, TW;

Inventors:

Ten-Hsing Jaw, Chengdu, CN;

Han Lung Tsai, Chengdu, CN;

I-chang Kuan, Chengdu, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 27/06 (2006.01);
U.S. Cl.
CPC ...
B32B 3/266 (2013.01); B32B 27/06 (2013.01); B32B 2457/20 (2013.01);
Abstract

An in-mold electronic component includes a first film layer, a functional module, a plastic layer, and a lead-out terminal. The first film layer is provided at a top surface of the in-mold electronic component. The functional module includes a circuit layer and an electronic component electrically connected to circuit layer. The plastic layer is configured to seal the functional module. One end of the lead-out terminal is electrically connected to the circuit layer, and the other end of the lead-out terminal is led out to a rear surface of the in-mold electronic component.


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