The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Dec. 07, 2022
Applicant:
Formlabs Inc., Somerville, MA (US);
Inventors:
Dmitri Megretski, Carlisle, MA (US);
Benjamin FrantzDale, Harvard, MA (US);
Jacob Sanchez, Cambridge, MA (US);
Alec Rudd, Arlington, MA (US);
Assignee:
Formlabs Inc., Somerville, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/30 (2017.01); B29C 64/264 (2017.01); B33Y 40/00 (2020.01); B29C 64/124 (2017.01); B29C 64/188 (2017.01); B29C 64/223 (2017.01); B29C 64/245 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/30 (2017.08); B29C 64/264 (2017.08); B33Y 40/00 (2014.12); B29C 64/124 (2017.08); B29C 64/188 (2017.08); B29C 64/223 (2017.08); B29C 64/245 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12);
Abstract
A method includes curing a photopolymer resin disposed between a first build surface and a flexible film layer to form a print layer of a printed part. Here, the print layer of the printed part defines a second build surface attached to the flexible film layer. The method also includes translating a peeling mechanism between the second build surface and the flexible film layer to detach the flexible film layer from the second build surface.