The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Feb. 03, 2022
Applicant:

Dexerials Corporation, Shimotsuke, JP;

Inventors:

Keisuke Mukasa, Shimotsuke, JP;

Yusuke Kubo, Shimotsuke, JP;

Keisuke Aramaki, Shimotsuke, JP;

Assignee:

Dexerials Corporation, Shimotsuke, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 15/26 (2006.01); B29C 43/00 (2006.01); B29C 43/56 (2006.01); F28F 3/00 (2006.01);
U.S. Cl.
CPC ...
B23P 15/26 (2013.01); B29C 43/003 (2013.01); B29C 43/56 (2013.01); F28F 3/00 (2013.01); B29C 2043/561 (2013.01); F28F 2255/06 (2013.01); F28F 2255/14 (2013.01);
Abstract

A method for producing a heat transfer sheet, includes: (A) forming a mixture including at least one of a carbon fiber and a boron nitride flake, an inorganic filler, and a binder resin into a molded body in which the at least one of the carbon fiber and the boron nitride flake is oriented in a thickness direction of the molded body; (B) slicing the molded body into a sheet shape to obtain a molded sheet; (C) pressing the molded sheet; and (D), after the pressing, inserting the molded sheet between films and performing a vacuum packing of the molded sheet with the films such that an uncured component of the binder resin present inside the molded sheet is exuded to a surface of the molded sheet, which is the heat transfer sheet.


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