The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Nov. 30, 2021
Applicant:

Rolls-royce Corporation, Indianapolis, IN (US);

Inventors:

Quinlan Yee Shuck, Indianapolis, IN (US);

Timothy Paul Fuesting, Indianapolis, IN (US);

Scott Nelson, Indianapolis, IN (US);

Raymond Ruiwen Xu, Indianapolis, IN (US);

Assignee:

Rolls-Royce Corporation, Indianapolis, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 11/00 (2006.01); B21D 47/00 (2006.01); B23K 11/11 (2006.01); B23K 15/00 (2006.01); B23K 26/22 (2006.01); B23K 101/02 (2006.01);
U.S. Cl.
CPC ...
B23K 11/0093 (2013.01); B21D 47/00 (2013.01); B23K 11/115 (2013.01); B23K 15/0006 (2013.01); B23K 15/008 (2013.01); B23K 26/22 (2013.01); B23K 2101/02 (2018.08);
Abstract

In some examples, a technique including positioning supports such that the supports are between a first metallic substrate and a second metallic substrate, wherein an undulating member is located between the first metallic substrate and the second metallic substrate, the undulating member defining a plurality of first peaks adjacent to a first surface of the first metallic substrate and a plurality of second peaks adjacent to a second surface of the second metallic substrate, wherein a first support of the supports is positioned such that the first support extends between a first peak of the plurality of first peaks and the second surface of the second metallic substrate; welding the first peak to the first surface of the first metallic substrate in an area of the first support; and removing the first support by at least one of a thermal removal process or a chemical removal process.


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