The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Mar. 12, 2021
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Ruijun Deng, Beijing, CN;

Mengjun Hou, Beijing, CN;

Zhukai Liu, Beijing, CN;

Jing Yu, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); A61L 27/16 (2006.01); A61L 27/56 (2006.01); B01F 23/00 (2022.01); B01F 23/41 (2022.01); B01F 101/23 (2022.01); B01L 7/00 (2006.01); B01L 9/00 (2006.01); B23Q 17/24 (2006.01); C07K 14/705 (2006.01); C08F 220/56 (2006.01); C08L 33/26 (2006.01); C12M 1/34 (2006.01); C12Q 1/04 (2006.01); C12Q 1/18 (2006.01); C12Q 1/686 (2018.01); G01N 1/31 (2006.01); G01N 21/17 (2006.01); G01N 21/3577 (2014.01); G01N 21/359 (2014.01); G01N 21/39 (2006.01); G01N 21/45 (2006.01); G01N 21/64 (2006.01); G01N 21/77 (2006.01); G01N 21/78 (2006.01); G01N 27/414 (2006.01); G01N 30/12 (2006.01); G01N 30/68 (2006.01); G01N 30/70 (2006.01); G01N 30/72 (2006.01); G01N 30/88 (2006.01); G01N 33/00 (2006.01); G01N 33/18 (2006.01); G01N 33/50 (2006.01); G01N 33/53 (2006.01); G01N 33/543 (2006.01); G01N 33/68 (2006.01); G01N 33/74 (2006.01); G01N 35/00 (2006.01); G01N 35/10 (2006.01); G06T 7/00 (2017.01); G06T 7/90 (2017.01); H10K 10/46 (2023.01); H10K 85/00 (2023.01); H10K 85/20 (2023.01);
U.S. Cl.
CPC ...
B01L 3/502715 (2013.01); B01L 7/52 (2013.01); B01L 2300/0645 (2013.01); B01L 2300/0663 (2013.01); B01L 2300/161 (2013.01); B01L 2300/1827 (2013.01);
Abstract

A detection chip, a method of using a detection chip and a reaction system are provided. The detection chip includes a first substrate, a micro-chamber definition layer and a heating electrode. The micro-chamber definition layer is located on the first substrate and defines a plurality of micro-reaction chambers. The heating electrode is located on the first substrate and closer to the first substrate than the micro-chamber definition layer, and configured to release heat after being energized. The heating electrode includes a plurality of sub-electrodes, orthographic projections of the plurality of micro-reaction chambers on the first substrate overlap with orthographic projections of at least two of the plurality of sub-electrodes on the first substrate, and the at least two of the plurality of sub-electrodes have different heating values per unit time after being energized.


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