The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Oct. 10, 2022
Applicant:

Delta Electronics, Inc., Taoyuan, CN;

Inventors:

Haoyi Ye, Shanghai, CN;

Jianhong Zeng, Shanghai, CN;

Yu Zhang, Shanghai, CN;

Peiqing Hu, Shanghai, CN;

Ziying Zhou, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); G06F 1/18 (2006.01); G06F 1/20 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01); H05K 7/10 (2006.01); H05K 7/20 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); G06F 1/188 (2013.01); G06F 1/20 (2013.01); H05K 1/0218 (2013.01); H05K 1/0262 (2013.01); H05K 1/141 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 7/10 (2013.01); H05K 7/2039 (2013.01); H01L 25/165 (2013.01); H05K 3/368 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10545 (2013.01);
Abstract

The present disclosure provides an assembly structure for providing power for a chip. The assembly structure includes a circuit board configured to provide a first electrical energy; a chip provided with at least one electrical energy input terminal; and a first power converting module provided with at least one power output terminal. The first power converting module is electrically connected to the circuit board and the chip, converts the first electrical energy to a second electrical energy, and supplies the second electrical energy to the chip. The circuit board, the chip and the first power converting module are stacked; and a projection of the at least one electrical energy input terminal of the chip on the circuit board and a projection of the at least one the power output terminal of the first power converting module on the circuit board, are at least partially overlapped.


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