The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Mar. 22, 2023
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Daniel D. Sunshine, Austin, TX (US);

Daniel A. Podhajny, Morgan Hill, CA (US);

Kathryn P. Crews, Menlo Park, CA (US);

Yohji Hamada, Wakayama, JP;

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); D03D 1/00 (2006.01); D03D 15/533 (2021.01); D03J 1/00 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/075 (2006.01); H05K 1/03 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); D03D 1/0088 (2013.01); D03D 15/533 (2021.01); D03J 1/00 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/49805 (2013.01); H05K 1/038 (2013.01); H05K 3/34 (2013.01); D10B 2401/16 (2013.01); D10B 2401/18 (2013.01); H01L 25/0753 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10636 (2013.01);
Abstract

Electrical components may have plastic packages. Contacts may be formed on exterior surfaces of the plastic packages. A plastic package for an electrical component may have an elongated shape that extends along a longitudinal axis. A first groove may run parallel to the longitudinal axis on a lower surface of the plastic package. A second groove may run perpendicular to the first groove on an opposing upper surface of the plastic package. The electrical components may be coupled to fibers in a fabric such as a woven fabric. A first solder connection may be formed between the first groove and a first fiber such as a weft fiber. A second solder connection may be formed between the second groove and a second fiber such as a warp fiber.


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