The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Feb. 28, 2022
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Takahiro Kitazume, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2023.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 28/10 (2013.01); H05K 1/181 (2013.01); H01L 23/552 (2013.01); H01L 25/165 (2013.01); H05K 2201/1003 (2013.01);
Abstract

An electronic component module includes a substrate, an inductor element, a plurality of mounting type electronic components, and a shield film. The substrate has a first main surface and a second main surface, and the second main surface side is a side to be mounted on another circuit board. A first mounting type electronic component and a second mounting type electronic component are mounted on the first main surface. The shield film covers the first mounting type electronic component and the second mounting type electronic component and the first main surface side. The inductor element is disposed inside the substrate.


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