The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Feb. 15, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yoontae Hwang, Seoul, KR;

Geunwoo Kim, Seoul, KR;

Wandon Kim, Seongnam-si, KR;

Hyunbae Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/417 (2006.01); H01L 23/522 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 29/41733 (2013.01); H01L 23/5226 (2013.01); H01L 29/45 (2013.01);
Abstract

An integrated circuit (IC) device includes a conductive region including a first metal on a substrate. An insulating film is on the conductive region. A conductive plug including a second metal passes through the insulating film and extends in a vertical direction. A conductive barrier pattern is between the conductive region and the conductive plug. The conductive barrier pattern has a first surface in contact with the conductive region and a second surface in contact with the conductive plug. A bottom surface and a lower sidewall of the conductive plug are in contact with the conductive barrier pattern, and an upper sidewall of the conductive plug is in contact with the insulating film. The conductive barrier pattern includes a vertical barrier portion between the insulating film and the conductive plug, and the vertical barrier portion has a width tapering along a first direction away from the conductive region.


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