The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Mar. 10, 2022
Applicant:

Quanzhou Sanan Semiconductor Technology Co., Ltd., Nanan, CN;

Inventors:

Shuning Xin, Xiamen, CN;

Zhen-Duan Lin, Xiamen, CN;

Yanqiu Liao, Xiamen, CN;

Junpeng Shi, Xiamen, CN;

Aihua Cao, Xiamen, CN;

Changchin Yu, Xiamen, CN;

Chen-Ke Hsu, Xiamen, CN;

Chi-Wei Liao, Xiamen, CN;

Chia-En Lee, Xiamen, CN;

Zheng Wu, Xiamen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01);
Abstract

A light-emitting diode (LED) packaging module includes light-emitting units arranged in an array having m row(s) and n column(s), an encapsulating layer, and a wiring assembly, where m and n each independently represents a positive integer. Each of the light-emitting units includes LED chips each including a chip first surface, a chip second surface, a chip side surface, and an electrode assembly disposed on the chip second surface. The encapsulating layer covers the chip side surface and fills a space among the LED chips. The wiring assembly is disposed on the chip second surface and is electrically connected to the electrode assembly.


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