The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Jul. 27, 2021
Applicant:
Fuji Electric Co., Ltd., Kanagawa, JP;
Inventors:
Narumi Sato, Matsumoto, JP;
Yuichiro Hinata, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H05K 1/18 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/75755 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/81136 (2013.01); H01L 2224/81815 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09163 (2013.01); H05K 2201/10303 (2013.01);
Abstract
A semiconductor device including: a semiconductor chip; a plurality of insulating substrates mounted with the semiconductor chip; a printed circuit board facing the plurality of insulating substrates; and a conductive member for electrically connecting the plurality of insulating substrates and the printed circuit board is provided. The printed circuit board has a first through part arranged between the plurality of insulating substrates being adjacent to each other in a top view, and a second through part different from the first through part in shape in the top view.