The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Feb. 10, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sangwon Lee, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a base substrate having a plurality of upper pads and a plurality of first and second lower pads, a semiconductor chip disposed on the base substrate and electrically connected to the plurality of upper pads, a solder resist layer having a plurality of openings exposing a region of each of the plurality of first and second lower pads, the exposed regions of the plurality of first and second lower pads having the same size, a plurality of first external connection conductors respectively disposed on the exposed regions of the plurality of first lower pads and having a first height and a first volume, and a plurality of second external connection conductors respectively disposed on the exposed regions of the plurality of second lower pads and having a second height, greater than the first height, and a second volume, greater than the first volume.