The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Nov. 30, 2021
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Atsushi Harikai, Osaka, JP;
Shogo Okita, Hyogo, JP;
Akihiro Itou, Kyoto, JP;
Toshiyuki Takasaki, Osaka, JP;
Abstract
The element chip manufacturing method includes: a preparing process of preparing a substrateincluding a plurality of element regions EA and a dividing region DA, the substratehaving a first principal surfaceX and a second principal surfaceY; a groove forming process of forming a groovein the dividing region DA from the first principal surfaceX side; and a grinding process of grinding the substratefrom the second principal surfaceY side, to divide the substrateinto a plurality of element chips. The grooveincludes a first regionconstituted by a side surface having a first surface roughness, and a second regionconstituted by a side surface having a second surface roughness larger than the first surface roughness. In the grinding process, grinding of the substrateis performed until reaching the first regionof the groove