The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Apr. 19, 2023
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Bon Hyeong Koo, Suwon-si, KR;

Seok Hyun Yoon, Suwon-si, KR;

In Ho Jeon, Suwon-si, KR;

Byung Kil Yun, Suwon-si, KR;

Se Yong Kim, Suwon-si, KR;

Min Jung Jang, Suwon-si, KR;

Geon Hoi Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/12 (2006.01); C04B 35/626 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1227 (2013.01); C04B 35/6262 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein the dielectric layer includes dielectric grains, wherein at least one of the dielectric grains includes a twin boundary, and wherein the dielectric layer includes a region in which a sum of lengths of the twin boundaries included in a 2 μm×2 μm region is 1.49 μm or more.


Find Patent Forward Citations

Loading…