The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

May. 14, 2021
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Kyosuke Inui, Tokyo, JP;

Toru Tonogai, Tokyo, JP;

Yuichi Oyanagi, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/04 (2006.01); H01F 27/29 (2006.01); H01F 27/28 (2006.01); H01F 41/06 (2016.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01F 27/2823 (2013.01); H01F 41/06 (2013.01);
Abstract

An electronic component according to the present invention includes: an element body containing metal particles and a resin; and a resin electrode layer formed on an electrode facing portion which is a part of an outer surface of the element body. The resin electrode layer contains a resin component and a conductor powder. In addition, the electrode facing portion includes an exposed portion formed by removing the resin on an outermost surface of the element body to expose a part of an outer periphery of the metal particles located on the outermost surface. Then, the resin electrode layer and the exposed portion of the electrode facing portion are joined to each other.


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