The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Mar. 02, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seonho Han, Suwon-si, KR;

Donghoo Jang, Suwon-si, KR;

Jongah Kim, Suwon-si, KR;

Shinhun Moon, Suwon-si, KR;

Hyungsoo Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); G04G 9/00 (2006.01); G04G 17/04 (2006.01);
U.S. Cl.
CPC ...
G06F 1/163 (2013.01); G04G 9/007 (2013.01); G04G 17/045 (2013.01); H05K 2201/055 (2013.01); H05K 2201/10151 (2013.01);
Abstract

An electronic device according to various embodiments of the present disclosure may comprise: a housing including a front plate facing forward and a rear plate facing rearward; a display assembly comprising a display visible through at least a portion of the front plate and which includes an upper portion, a lower portion overlapping at least a partial region of the upper assembly and that includes a first opening, and a flexible circuit board overlapping at least a partial region of the lower portion and that includes a second opening corresponding to at least a portion of the first opening; a photosensor module including a sensing unit comprising a sensor corresponding to at least a portion of the second opening, and a plurality of pads arranged to be adjacent to the sensing unit and electrically coupled to the flexible circuit board; and an electrical component and/or mechanical structure arranged between the photosensor module and the rear plate and spaced from the photosensor module at a first distance.


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