The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Oct. 13, 2021
Applicant:

Fujifilm Business Innovation Corp., Tokyo, JP;

Inventors:

Takako Kobayashi, Kanagawa, JP;

Yoshifumi Iida, Kanagawa, JP;

Takashi Hasegawa, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 9/087 (2006.01); G03G 9/08 (2006.01); G03G 9/097 (2006.01); G03G 15/00 (2006.01); G03G 15/08 (2006.01);
U.S. Cl.
CPC ...
G03G 9/09733 (2013.01); G03G 9/0819 (2013.01); G03G 9/0825 (2013.01); G03G 9/09708 (2013.01); G03G 9/09791 (2013.01); G03G 15/0865 (2013.01); G03G 15/6582 (2013.01);
Abstract

Pressure-responsive particles include pressure-responsive base particles and resin particles, in which the pressure-responsive base particles contain a styrene-based resin that contains styrene and other vinyl monomers as polymerization components and a (meth)acrylic acid ester-based resin that contains at least two kinds of (meth)acrylic acid esters as polymerization components, a ratio of a mass of the (meth)acrylic acid esters to a total mass of polymerization components is 90% by mass or more in the (meth)acrylic acid ester-based resin, the pressure-responsive particles have at least two glass transition temperatures, a difference between a lowest glass transition temperature and a highest glass transition temperature is 30° C. or higher, and a ratio of a mass of the resin particles to a total mass of the pressure-responsive particles is 0.05% by mass or more and 2.0% by mass or less.


Find Patent Forward Citations

Loading…