The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Feb. 25, 2020
E.on Sverige Ab, Malmo, SE;
Per Rosén, Lund, SE;
Jacob Skogström, Lomma, SE;
Fredrik Rosenqvist, Helsingborg, SE;
Bengt Lindoff, Bjarred, SE;
E.ON SVERIGE AB, Malmo, SE;
Abstract
A heat pump assembly () is presented. The heat pump assembly () comprises a heat pump () having a primary side inlet () and a primary side outlet (); a primary side inlet valve assembly () comprising: a primary side inlet connection () connected to the primary side inlet (), a primary side inlet valve first conduit connection () configured to be connected to a first conduit () of a thermal energy grid (), and a primary side inlet valve second conduit connection () configured to be connected to a second conduit () of the thermal energy grid (); a first conduit temperature determining device () configured to measure a local temperature, t, of heat transfer liquid of the first conduit (); a second conduit temperature determining device () configured to measure a local temperature, t, of heat transfer liquid of the second conduit (); and a controller (). The controller is configured to: receive hand tfrom the first and second conduit temperature determining devices (), receive information pertaining to whether the heat pump () is a heating mode heat pump or a cooling mode heat pump. The controller is configured to upon the heat pump () is the heating mode heat pump and upon t>tset the primary side inlet valve assembly () to fluidly connect the primary side inlet valve first conduit connection () and the primary side inlet connection (), primary side inlet valve assembly () to fluidly connect the primary side inlet valve or upon the heat pump () is the heating mode heat pump and upon t>t, set the second conduit connection () and the primary side inlet connection (). The controller is configured to upon the heat pump () is the cooling mode heat pump and upon t>t, set the primary side inlet valve assembly () to fluidly connect the primary side inlet valve second conduit connection () and the primary side inlet connection (), or upon the heat pump () is the cooling mode heat pump and upon t>t, set the primary side inlet valve assembly () to fluidly connect the primary side inlet valve first conduit connection () and the primary side inlet connection ().