The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Oct. 19, 2022
Applicants:

Luke Dewight Steinmetz, Hot Springs, SD (US);

Ronald Ryan Raphoon, Spring, TX (US);

Robert H. Hrabe, Rapid City, SD (US);

Inventors:

Luke Dewight Steinmetz, Hot Springs, SD (US);

Ronald Ryan Raphoon, Spring, TX (US);

Robert H. Hrabe, Rapid City, SD (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F16L 55/175 (2006.01); C23C 24/04 (2006.01); F16L 55/168 (2006.01); F16L 58/02 (2006.01);
U.S. Cl.
CPC ...
F16L 55/175 (2013.01); C23C 24/04 (2013.01); F16L 55/1686 (2013.01); F16L 58/02 (2013.01);
Abstract

Methods of providing an inspection detectable repair to a component may include providing a component to be repaired having a substrate with a surface. The methods may include identifying a compromised region of a compromised portion of the substrate of the component, with the compromised region having at least one void, and providing material to form a filler material to be applied to the surface of the substrate to be repaired. The methods may include applying particles of filler material as a cold spray deposition utilizing a cold spray deposition apparatus, with particles of filler material forming a deposit of cold sprayed particles on the surface of the substrate adjacent to the at least one void. The methods may include wrapping the substrate of the component with at least one layer of wrap material to cover at least a portion of the deposit of filler material on the substrate.


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