The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Sep. 19, 2023
Applicant:

The Boeing Company, Arlington, VA (US);

Inventors:

Christopher R. Shurilla, Palm Desert, CA (US);

Zackary L. Endsley, Wailuku, HI (US);

John C. Mooney, Makawao, HI (US);

Steven Fulton Griffin, Kihei, HI (US);

Alexander C. Klein, Bellevue, WA (US);

Frederick Theodore Calkins, Renton, WA (US);

Assignee:

The Boeing Company, Arlington, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F03G 7/06 (2006.01); B64G 1/44 (2006.01);
U.S. Cl.
CPC ...
F03G 7/06145 (2021.08); B64G 1/443 (2013.01);
Abstract

A deployable panel is provided comprising a first subpanel, a second subpanel, and a shape memory alloy hinge connecting the subpanels. The shape memory alloy hinge enables the subpanels to move between a position in which the first and second subpanels are folded over each other and an unfolded position in response to an energy source that changes the shape of the shape memory alloy hinge, wherein the unfolded position is trained into the shape memory alloy hinge to ensure precise kinematic mating between the subpanels. Shape memory alloy springs are connected to the first subpanel and respective tethers connect the shape memory alloy springs to the second subpanel. The shape memory alloy springs contract in response to a second energy source to pull the subpanels together via the tethers when the subpanels are in the unfolded position to produce a seamless, featureless surface of the deployable panel.


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