The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Sep. 07, 2017
Applicant:

Modumetal, Inc., Seattle, WA (US);

Inventors:

Christina Ann Lomasney, Seattle, WA (US);

Guohua Li, Bothell, WA (US);

Assignee:

MODUMETAL, INC., Snohomish, WA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/147 (2017.01); B29C 33/04 (2006.01); B29C 33/56 (2006.01); C23C 18/16 (2006.01); C25D 1/10 (2006.01); C25D 3/02 (2006.01); C25D 5/00 (2006.01); C25D 5/10 (2006.01); C25D 5/12 (2006.01); C25D 5/56 (2006.01); B29C 33/38 (2006.01); B29C 49/00 (2006.01); B29L 31/50 (2006.01); C23C 18/20 (2006.01); C23C 18/24 (2006.01); C23C 18/30 (2006.01);
U.S. Cl.
CPC ...
C25D 5/623 (2020.08); B29C 33/565 (2013.01); B29C 64/147 (2017.08); C23C 18/1653 (2013.01); C25D 1/10 (2013.01); C25D 3/02 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 5/56 (2013.01); C25D 5/617 (2020.08); B29C 33/04 (2013.01); B29C 33/38 (2013.01); B29C 2033/385 (2013.01); B29C 33/56 (2013.01); B29C 49/00 (2013.01); B29L 2031/50 (2013.01); C23C 18/2086 (2013.01); C23C 18/24 (2013.01); C23C 18/30 (2013.01);
Abstract

Embodiments of the present disclosure provide molds made by additive manufacturing coupled with electrodeposition. Such methods comprise subjected a workpiece to one or more deposition process(es), such as electrodeposition, that provide a coating that possesses desirable chemical, physical, and/or mechanical properties. In some embodiments, the methods further comprise forming at least one workpiece for the mold by, for example, an additive manufacturing process such as three-dimensional printing (3D printing). Additionally, the present disclosure provides methods for the use of a mold for molding polymerizable, settable, thermoplastic, or thermoset materials.


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