The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Oct. 18, 2019
Applicant:

Posco, Pohang-si, KR;

Inventors:

Jae-Seung Lee, Pohang-si, KR;

Yo-Sep Yang, Pohang-si, KR;

In-Gyu Park, Pohang-si, KR;

Han-Hwi Kim, Pohang-si, KR;

Assignee:

POSCO CO., LTD, Pohang-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 38/22 (2006.01); C21D 8/00 (2006.01); C21D 8/06 (2006.01); C21D 9/52 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01);
U.S. Cl.
CPC ...
C22C 38/22 (2013.01); C21D 8/065 (2013.01); C21D 9/525 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C21D 2211/005 (2013.01); C21D 2211/009 (2013.01);
Abstract

The present disclosure relates to a steel wire rod enabling the omission of softening heat treatment and a method of manufacturing same. An embodiment of the present disclosure provides a steel wire rod enabling the omission of softening heat treatment and a method of manufacturing same, the steel wire rod comprising, in weight %, 0.2-0.45% of C, 0.02-0.4% of Si, 0.3-1.5% of Mn, 0.01-1.5% of Cr, 0.02-0.05% of Al, 0.01-0.5% of Mo, 0.01% or less of N, and the balance Fe and other unavoidable impurities, wherein the microstructure of the steel wire rod is a composite structure of proeutectoid ferrite+perlite as a main phase; the steel wire rod contains 10 area % or less (including 0%) of at least one of bainite or martensite; and the average colony size of the perlite is 5 μm or less.


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