The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Jun. 18, 2021
Signify Holding B.v., Eindhoven, NL;
Rifat Ata Mustafa Hikmet, Eindhoven, NL;
Ties Van Bommel, Horst, NL;
Oliver Francis Burke, Eindhoven, NL;
SIGNIFY HOLDING B.V., Eindhoven, NL;
Abstract
The invention provides a light generating device () comprising a light source () and a luminescent element (), wherein:—the light source () is configured to generate the first radiation (); wherein the light source () comprises a laser light source;—the luminescent element () comprises (i) a plurality of element bodies () and (ii) a thermally conductive support (); wherein the plurality of element bodies () comprises a plurality of first bodies () and a plurality of second bodies ();—the plurality of first bodies () comprise a luminescent material (), wherein the luminescent material () is configured to convert at least part of first radiation (), selected from one or more of UV radiation and visible radiation, into luminescent material light (); wherein the first bodies have a first thermal conductivity K1; wherein the first bodies () are configured in a light receiving relationship with the light source ();—the plurality of second bodies (), different from the first bodies () are light transmissive for one or more wavelengths of the first radiation () and the luminescent material light (); wherein the second bodies () have a second thermal conductivity K2, wherein K2≥0.2*K1;—the plurality of first bodies () and the plurality of second bodies () are configured in a 2D arrangement (), wherein for a plurality of second bodies () applies that they are configured adjacent to different first bodies (); and—the plurality of first bodies () and second bodies () are configured in thermal contact with the thermally conductive support ().
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